Diamond powders encapsulated in metal increase life of diamond compacts
Powdermet Inc., Euclid, Ohio, offers DiaBond, a family of engineered diamond powders specially designed to improve bonding in metallic matrices, including nickel-, cobalt-, copper-, and aluminum-based binders. DiaBond powders are comprised of diamond grains encapsulated in a 1-20 micron coating of cobalt, nickel, chromium, chromium carbide, tungsten, tungsten carbide, copper, aluminum, silicon, or rhenium. These coated diamond powders typically show a three-fold increase in diamond retention, extending life and increasing thermal conductivity and strength of diamond compacts made of Powdermet’engineered diamond particles.
Applications include metal-bond diamond wheels, diamond compacts and cermets, diamond hardfacing products, high conductivity substrates, and other thermal and abrasive products. The powders are engineered by Powdermet’s patented fluidized bed chemical vapor deposition technology. They can be produced in grit sizes ranging from micron-sized diamond dust to 30 grit diamond abrasives.
https://www.powdermetinc.com/diabond.html
Original article here: www.asminternational.org
Powdermet Group of Companies
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